PCB size: 24*24”(max); 16*16”(min)
Board thickness: 0.05~2.0mm
FPC size: 16*16”(max); 9.8*9.8”(min)
Board thickness: 0.036~1mm
Conveyor speed: 0.2~1.6M/min(adjustable）
Plating window： 610*3000mm/tank(PCB);
400*3000mm/tank(FPC)
Current density: 35ASF(max)forDC Rectifer
Anodestyle: can be used with insoluble and soluble anode
Cathode type: Continuousvertical panel clamping type
Board space: 5mm
Characteristicsdescription：
0.036 mm FPC without auxiliary frame production lines,
greatly reduced the production cost
Automatic six axis robotic armloading&unloading system,
improve the production efficiency
No transfer during loading&unloadingsystem,
reduce FPC wrinkle
FPC board cleaning without dead workingspace, no residue
Without auxiliary frame, greatly reduce thechemicals bring
in and bring out volume
No auxiliary frame use and maintenance costs
Long-term buy auxiliary frame andmaintenance costs，
increase FPC production cost
Loading and clamping auxiliary framemanually, FPC board need
transfer between different working stations,increase FPC wrinkle
It takes more operators to unloading FPC andremove the auxiliary
frame, increase labor cost
To stripping copper on auxiliary framefrequently
Auxiliary frame produce more dead workingspace, acid residue is
more difficult to clean, easy to causesurface oxidation
Auxiliary frame increase the chemicals bringin and bring out volume
Copper platinguniformity on board surface and through hole
(FPCcustomer measured data)
process parameter：
plating time:25min current density：2.75A/dm2 copperthickness:15um
